At AMD, we believe technology has the power to solve the world's most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. SENIOR PACKAGING ENGINEER

Help turn 'possibility' into 'reality' every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.

We are seeking a highly experienced Senior Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, energetic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The ideal candidate is an experienced package or silicon physical designer who:
Applies AI/ML and automation to improve design productivity and quality
Operates with minimal supervision while influencing cross-functional teams
Perform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D,



chiplet-based architectures)
Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
Interface with stakeholders to communicate design status, risks, and mitigation strategies

PREFERRED EXPERIENCES:

- Minimum 2+ years of experience in designing complex substrate design or Silicon Bridge or Interposers
- Proven ability to execute in multi-project, fast-phased, and high-pressure environments
- Strong experience in advanced packaging technologies:
- 2.5D / 3D integration (e.g., Hands-on experience with EDA tools such as:

Experience working with OSATs, foundries, and substrate vendors

ACADEMIC CREDENTIALS:

~ Bachelor's or higher degree in Electrical Engineering, Computer Engineering, or related field

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's 'Responsible AI Policy' is available

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