Sr. Packaging Engineer (Semiconductor) (Hyderabad)

Sr. Packaging Engineer (Semiconductor) (Hyderabad)

03 Nov
|
Semtech
|
Hyderabad

03 Nov

Semtech

Hyderabad

Responsibilities:

- Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio. (25%)
- OSAT Partner Management: Serve as a technical interface with external assembly and test (OSAT) partners, su]]>

📌 Sr. Packaging Engineer (Semiconductor) (Hyderabad)
🏢 Semtech
📍 Hyderabad

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