RESPONSIBILITIES:
• Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.
• Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.
• Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).
• Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.
• Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.
• Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.
• Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.
• Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.
• Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.




• Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.
• Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.
• Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.
• Coordinate with global teams to benchmark molding process technologies and deploy global best practices.

Education:
• Bachelor’s degree in Mechanical, Materials, Electronics Engineering or a related field. Experience & Skill:
• Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging.
• Hands-on experience with transfer molding machines, mold tools, and associated metrology systems.
• Solid analytical and statistical skills (SPC, Minitab, JMP, etc.).
• Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.
• Proven experience in process optimization, problem-solving, and cross-functional collaboration.

📌 Process Engineering (Jagiroad)
🏢 Tata Electronics Private
📍 Jagiroad