Advanced BGA Rework Engineer

Role Overview The Advanced BGA Rework Engineer is responsible for developing, standardizing, and executing precision rework and repair processes for high-density, high-reliability PCB assemblies. This role focuses on fine-pitch Ball Grid Arrays (BGAs), Chip-Scale Packages (CSPs), Quad Flat No-leads (QFNs), and bottom-terminated components (BTCs) using semi-automated rework systems, thermal profiling tools, and specialized soldering equipment.

Key Responsibilities

- Develop, optimize, and validate thermal profiles for BGA de-soldering, site redressing, and component re-soldering across multi-layer, high-thermal-mass circuit boards.

- Operate and calibrate semi-automated rework stations (e.g., Ersa, VisiConsult, Finetech, PDR, or Air-Vac) for accurate component alignment and placement.

- Perform component reballing, pad repair, track repair, micro-soldering, and epoxy underfill removal without damaging adjacent components or board laminate.

- Inspect rework joints using optical microscopes and coordinate with X-ray inspection teams to evaluate solder voiding, bridging, and head-in-pillow (HiP) defects.





- Ensure all rework processes strictly adhere to IPC-7711/7721 (Rework, Modification, and Repair of Electronic Assemblies) Class 3 requirements.

- Maintain equipment, manage specialized tooling/nozzles, and maintain detailed logs of reworked boards, root causes, and yield impacts.

Required Qualifications

- Bachelor’s degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Science, or relevant technical trade diploma.

- 4–8 years of direct, hands-on experience in SMT rework and precision micro-soldering.

- Active certification in IPC-7711/7721 and IPC-A-610 (CIT or CIS).

- Proven track record working with high-density interconnect (HDI) boards, high-pin-count BGAs (>1,000 balls), and micro-BGAs (<0.4 mm pitch).

- Thorough knowledge of flux chemistry (no-clean, water-soluble), leaded vs. lead-free solder alloys (SAC305, SnPb), and intermetallic compound (IMC) formation.

Pay: ₹800,000.00 - ₹1,400,000.00 per year

Work Location: In person

📌 Advanced BGA Rework Engineer (Bengaluru)
🏢 Flipped.ai
📍 Bengaluru