We are looking for a
Staff Physical Design Engineer
with solid hands-on expertise in
full-chip physical implementation, timing closure, and signoff
for complex SoC designs.
Key Responsibilities
Own
full-chip RTL-to-GDSII
implementation across synthesis, floorplanning, placement, CTS, routing and signoff.
Drive
MCMM STA, setup/hold closure, ECOs and critical path optimization
.
Resolve
congestion, IR/EM, signal integrity, DRC/LVS and physical design issues
.
Optimize
PPA, timing, power and area
across implementation stages.
Collaborate with RTL, STA, DFT, PD and signoff teams to drive
tapeout readiness
.
Develop and enhance
PD flows and automation
using Tcl/Python/Perl.
Core Technical Skills
Strong
full-chip Physical Design / ASIC implementation
experience.
Hands-on with
Synopsys ICC2/Fusion Compiler, PrimeTime, Design Compiler
or equivalent.
Deep understanding of
STA, MCMM, CTS, timing closure and ECO methodology
.
Robust expertise in
floorplanning, power planning, placement and routing
.
Experience with
advanced-node SoCs and complex clocking architectures
preferred.
Robust scripting and debugging skills.
Ideal Candidate:
A highly hands-on Physical Design engineer who can independently drive
full-chip implementation and timing closure
through tapeout.