About the Role

As an Application Engineer, you will act as a trusted technical strategist bridging LightSpeed’s high-bandwidth optical interconnect platforms with our customers' next-generation system designs. You will partner with system architects, CTOs, and hardware designers across data centers, chipmakers, and OEMs—driving solutions from initial architectural concept and PoC validation through to volume production.

Key Responsibilities

- Technical Consulting & Solution Architecture: Lead system-level design reviews, map customer constraints (signal integrity, thermal, power delivery, PCB stack-up) to LightSpeed solutions, and conduct technical workshops for key decision-makers.
- Design-Win Pipeline Management: Drive adoption across target accounts (AI/ML workloads, high-density switching, edge systems) and track technical progress through prototyping, PoC, and mass production.
- Hands-on Integration & Support: Provide hands-on debug and bring-up support for high-speed hardware integration, PCIe-over-fiber (LightPCIe™), Near-Package / Co-Packaged Optics (CPO), and FPGA systems.
- Collateral & Ecosystem Development: Create application notes, hardware reference designs, evaluation kits,



and bench demos; partner with OSATs and silicon design houses to validate workflows.

Qualifications & Skills

- Education: Bachelor’s or Master’s in ECE, Electrical Engineering, Photonics/Optoelectronics, Physics, or a related discipline.
- Hardware & SI Expertise: Strong hands-on experience with high-speed serial protocols (PCIe Gen 5/6, high-speed SerDes, Ethernet), board-level SI/PI considerations, and high-frequency PCB layout rules.
- System Architecture: Experience working with reference designs for servers, network switches, NICs, or FPGA-based prototyping/SoM platforms.
- Optoelectronics (Preferred): Familiarity with optical transceivers, optical engines, fiber communication protocols, or co-packaged optics (CPO).
- Added Advantage: Exposure to embedded SoC FPGAs (ARM/RISC-V, C/C++), DSP modeling (MATLAB/Simulink), or edge AI/ML frameworks (OpenVINO, FPGA AI Suite).
- Attributes & Travel: Customer-first problem-solving mindset under pressure; ability to work independently in a fast-paced workplace; willingness to travel regionally and internationally for client visits and industry conferences.

📌 Application Engineer (Hyderabad)
🏢 LightSpeed Photonics
📍 Hyderabad