Responsibilities:
Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals
To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements
Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.
Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups
Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork




Demonstrate behavior consistent with the company’s Code of Ethics and Conduct
It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem.

Qualifications:
10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
Programming skills with automatic epoxy machines, Optical measurement systems desirable.
Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.

📌 Sr Process & Production Engineer Rangareddy (Ranga Reddy)
🏢 Optoelectronics
📍 Ranga Reddy