Hiring for 3D Glass Solutions, Inc. — via Flexiple, the recruiting partner on this role.

About Company

3D Glass Solutions (3DGS) is a US advanced-packaging company using its patented photo-definable APEX® glass technology for RF, photonics, IC and system-in-package devices. Through its Indian entity, 3DGS is building a vertically integrated glass-core substrate and chip assembly plant in Bhubaneswar, Odisha, approved under the India Semiconductor Mission. The assembly team is small today, and the people who join now will select tools, qualify the line and build the teams that run it.

Job Roles & Responsibilities

- Lead development, optimization and qualification of ball attach (strip and singulated), reflow, cleaning, TIM and lid attach, strip saw singulation, laser marking, AVI/X-ray inspection and bake and dry pack for FCBGA, fcCSP and wbCSP products
- Own combined process and equipment ownership for the module: process windows, tool qualification (SAT, IQ/OQ/PQ), equipment capability and module yield
- Own the end-of-line quality gate: lot acceptance, sampling plans, MSL classification, dry pack, packing/labeling controls and outgoing quality data
- Lead root cause analysis for defects such as missing/double balls, ball voids, coplanarity excursions, TIM voids, lid tilt, chipping, burrs and delamination
- Establish AVI and X-ray inspection strategy, recipes,



accept criteria and escape/false-call monitoring
- Qualify solder balls, fluxes, TIMs, lid adhesives, blades and jigs with suppliers
- Build, train and certify the end-of-line team of engineers and technicians
- Drive PM optimization, spares strategy and troubleshooting on ball attach, lid attach, saws, laser markers, inspection and dry pack equipment

Ideal Candidate Profile

- 10+ years hands-on in ball attach, lid attach, singulation, inspection and packing at an OSAT, ATMP or IDM assembly site, owning multiple tool types
- Engineering degree in Mechanical, Materials, Electrical, Chemical, Industrial or a related field
- Part of at least one recent line installation, qualification or capacity ramp
- Has trained and certified entry-level engineers and technicians in a multi-tool production environment
- Experience with SPC, DOE, FMEA, process characterization, yield analysis and structured troubleshooting
- Prior leadership of engineers, technicians and cross-functional teams in a production or ramp environment
- Willing to relocate to Bhubaneswar, Odisha
- Strong grasp of solder ball metallurgy, coplanarity, TIM/lid adhesive behavior and J-STD-020 MSL/dry pack requirements
- Experience with strip and singulated flows, large-body lidded FCBGA and outgoing quality gate ownership is highly preferred

Originally posted on: 30 Sept 2026

📌 Group Leader – End of Line (Ball, Lid, Saw & Pack) (Bhubaneswar)
🏢 Flexiple
📍 Bhubaneswar