Hiring for 3D Glass Solutions, Inc. — via Flexiple, the recruiting partner on this role.

About Company

3D Glass Solutions (3DGS) is a US advanced-packaging company using its patented photo-definable APEX® glass technology for RF, photonics, IC and system-in-package devices. Through its Indian entity, 3DGS is building a vertically integrated glass-core substrate and chip assembly plant in Bhubaneswar, Odisha, approved under the India Semiconductor Mission. The assembly team is small today, and the people who join now will select tools, qualify the line and build the teams that run it.

Job Roles & Responsibilities

- Lead development, optimization and qualification of flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill and cure for FCBGA, fcCSP and wbCSP products
- Own combined process and equipment ownership for the module: process windows, tool qualification (SAT, IQ/OQ/PQ), equipment capability and module yield
- Define and control critical parameters including bond force, temperature and dwell, placement accuracy, flux transfer, reflow profile, plasma conditions, underfill dispense and cure profile
- Lead root cause analysis for defects such as non-wet opens, bridging, head-in-pillow, solder voids, die tilt, underfill voiding, delamination and die cracking
- Set the substrate warpage strategy through reflow with package design
- Qualify fluxes, underfills,



epoxies and die attach films with suppliers
- Build, train and certify the die attach and underfill team of engineers and technicians
- Drive PM optimization, spares strategy and troubleshooting on bonders, reflow ovens, plasma systems, dispensers and cure ovens
- Lead introduction of thermo-compression and laser-assisted bonding as those platforms are added

Ideal Candidate Profile

- 10+ years hands-on in flip chip die attach, die bonding and underfill at an OSAT, ATMP or IDM assembly site, owning multiple tool types
- Engineering degree in Mechanical, Materials, Electrical, Chemical, Industrial or a related field
- Part of at least one new line installation, qualification or capacity ramp
- Has trained and certified entry-level engineers and technicians in a multi-tool production environment
- Experience with SPC, DOE, FMEA, process characterization, yield analysis and structured troubleshooting
- Prior leadership of engineers, technicians and cross-functional teams in a production or ramp environment
- Willing to relocate to Bhubaneswar, Odisha
- Robust grasp of solder joint metallurgy, copper pillar and C4 bumps, warpage through reflow and underfill flow mechanics
- Experience with X-ray, C-SAM, cross-sectioning, die shear and fine-pitch low-standoff underfill is highly preferred

Originally posted on: 30 Sept 2026

📌 Group Leader – Die Attach & Underfill (Bhubaneswar)
🏢 Flexiple
📍 Bhubaneswar